Channel and Pin Assignment for Three Dimensional Packaging Routing
نویسندگان
چکیده
Three dimensional packaging is becoming a popular concept because of the numerous advantages it has to offer over the existing conventional technologies such as PCB and MCM. System on Packages (SOP) is an example of three dimensional packaging. In this paper, we present the channel and pin assignment algorithms for 3D packaging routing. There exist multiple floorplan, routing, and pin distribution layers in SOP. The purpose of SOP channel assignment is to finish the connection between a pair of floorplan and pin distribution layers. We perform SOP pin assignment in case the pin location of some blocks in floorplan layer is not known. Our related experimental results demonstrate the effectiveness of our algorithm.
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تاریخ انتشار 2004